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Scientists Prove Better Thermoelectric Properties in Copper Antimony Alloy

Nov 03, 2020

Recently, a research group led by Prof Qin Xiaoying from the Institute of Solid State Physics, Hefei Institutes of Physical Science has made new progress in the thermoelectric performance of Cu3SbSe4. The result obtained from the study proved excellent thermoelectric properties in copper-antimony alloys which were achieved via synergistic regulation of power factors and thermal conductivity.

Thermoelectric materials enables direct conversion between heat and electricity. Therefore, it has been considered as a kind of potentially sustainable energy as it can be used for solid-state refrigerators or heat pumps, replacing moving parts or liquids which are widely used now and harmful to the environment.

In this study, AgSb0.98Sn0.02Se2, a kind of nano particles, were introduced into Cu3Sb0.96Sn0.04Se4 matrix, and thus new nanocomposites Cu3Sb0.96Sn0.04Se4 /x wt% AgSb0.98Sn0.02Se2 (x = 0,1,3,5,7) were formed by grinding and electrospark plasma sintering.

The ZT value of Cu3Sb0.96Sn0.04Se4/5wt% AgSb0.98Sn0.02Se2 sample reached a record of 1.17 due to the reduction of thermal conductivity and the enhancement of carrier mobility, which showed good thermoelectric performance.

Tetrahedrite Cu3SbSe4 has attracted much attention due to its cheap components, low intrinsic lattice thermal conductivity and excellent electrical transport properties. However, there is no effective method to increase the power factor and decrease the thermal conductivity simultaneously. The experiment provides a new strategy for improving performance of thermoelectric materials.

This work was supported by the funding support from the Natural Science Foundation of China.

 

(a) Powder XRD patterns of Cu3Sb0.94Sn0.96Se4-ySy (y = 0.5, 1, and 1.5). (b) Lattice parameter a and c with the sulfur content. (Image by CHEN Tao)

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ZHAO Weiwei

Hefei Institutes of Physical Science

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Synergetic modulation of power factor and thermal conductivity for Cu3SbSe4-based system

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